UPC: 0841163075845 | Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A
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UPC: 0841163075845 | Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A
Description
UPC lookup results for: 0841163075845 | Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A
Designed to lower CPU temperatures effectively TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that the TG-30’s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.